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 STW9N150
N-channel 1500V - 2.2 - 8A - TO-247 Very high voltage PowerMESHTM Power MOSFET
TARGET SPECIFICATION
General features
Type STW9N150

VDSS 1500V
RDS(on) < 2.7
ID 8A
Pw 350W
100% avalanche tested Avalanche ruggedness Gate charge minimized Very low intrinsic capacitances High speed switching Very low on-resistance
TO-247
Description
Using the well consolidated high voltage MESH OVERLAYTM process, STMicroelectronics has designed an advanced family of Power MOSFETs with outstanding performances. The strengthened layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, unrivalled gate charge and switching characteristics.
Internal schematic diagram
Applications
Switching application
Order code
Part number STW9N150 Marking W9N150V Package TO-247 Packaging Tube
May 2007
Rev 1
1/9
www.st.com 9
This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice.
Electrical ratings
STW9N150
1
Electrical ratings
Table 1.
Symbol VDS VGS ID ID IDM
(1)
Absolute maximum ratings
Parameter Drain-source voltage (VGS = 0) Gate- source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC = 100C Drain current (pulsed) Total dissipation at TC = 25C Derating factor Value 1500 30 8 5 32 350 0.37 -55 to 150 Unit V V A A A W W/C C
PTOT
Tj Tstg
Operating junction temperature Storage temperature
1. Pulse width limited by safe operating area
Table 2.
Symbol
Thermal data
Parameter Value 0.36 62.5 Unit C/W C/W
Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max
Table 3.
Symbol IAR EAS
Avalanche characteristics
Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) Single pulse avalanche energy (starting Tj = 25C, ID = IAR, VDD = 50V) Max value Tbd Tbd Unit A mJ
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STW9N150
Electrical characteristics
2
Electrical characteristics
(Tcase =25C unless otherwise specified) Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on
On /off states
Parameter Drain-source breakdown voltage Test conditions ID = 1mA, VGS = 0 Min. 1500 10 500 100 3 4 2.2 5 2.7 Typ. Max. Unit V A A nA V
VDS = Max rating Zero gate voltage drain current (VGS = 0) VDS = Max rating, TC=125C Gate-body leakage current (VDS = 0) VGS = 30V
Gate threshold voltage VDS = VGS, ID = 250A Static drain-source on resistance VGS = 10V, ID = 1.3A
Table 5.
Symbol gfs (1) Ciss Coss Crss
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Gate input resistance Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 30V, ID = 2A Min. Typ. Tbd 3600 280 35 Max. Unit S pF pF pF
VDS = 25 V, f = 1 MHz, VGS = 0
Rg Qg Qgs Qgd
f=1MHz Gate DC Bias=0 Test signal level=20mV open drain VDD = 600V, ID = 2.5A, VGS = 10V (see Figure 2)
2 90 Tbd Tbd
nC nC nC
1. Pulsed: Pulse duration = 300 s, duty cycle 1.5%
3/9
Electrical characteristics
STW9N150
Table 6.
Symbol td(on) tr td(off) tf
Switching times
Parameter Turn-on delay time Rise time Turn-off-delay time Fall time Test conditions VDD = 750V, ID = 2A, RG = 4.7, VGS = 10V (see Figure 1) Min. Typ. Tbd Tbd Tbd Tbd Max Unit ns ns ns ns
Table 7.
Symbol ISD ISDM
(1)
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 4A, VGS = 0 ISD = 4A, di/dt = 100A/s VDD= 45V Tj = 25C (see Figure 3) ISD = 4A, di/dt = 100A/s VDD= 45V Tj = 150C (see Figure 3) Tbd Tbd Tbd Tbd Tbd Tbd Test conditions Min. Typ. Max Unit 8 32 Tbd A A V ns C A ns C A
VSD (2) trr Qrr IRRM trr Qrr IRRM
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300s, duty cycle 1.5%
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STW9N150
Test circuits
3
Figure 1.
Test circuits
Switching times test circuit for resistive load Figure 2. Gate charge test circuit
Figure 3.
Test circuit for inductive load Figure 4. switching and diode recovery times
Unclamped Inductive load test circuit
Figure 5.
Unclamped inductive waveform
Figure 6.
Switching time waveform
5/9
Package mechanical data
STW9N150
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
6/9
STW9N150
Package mechanical data
TO-247 MECHANICAL DATA
mm. MIN. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 0.140 0.177 0.216 14.80 4.30 0.560 0.14 0.728 0.143 0.216 TYP MAX. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 MIN. 0.19 0.086 0.039 0.079 0.118 0.015 0.781 0.608 0.214 0.582 0.17 inch TYP. MAX. 0.20 0.102 0.055 0.094 0.134 0.03 0.793 0.620
DIM. A A1 b b1 b2 c D E e L L1 L2 oP oR S
7/9
Revision history
STW9N150
5
Revision history
Table 8.
Date 24-May-2007
Revision history
Revision 1 First release Changes
8/9
STW9N150
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
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